Focus on high-end precision manufacturing, research and development -
China's leading domestic manufacturer of camera module
(27 Nov 2017) – Q Technology (Group) Company Limited (“Q Technology” or “the Company”, together with its subsidiaries, collectively known as “the Group”, HKSE stock code: 1478.HK) -- one of the leading PRC-based camera module and fingerprint recognition module suppliers focusing on the mid-to-high market for Chinese branded smartphones and tablets -- is pleased to announce that the 2017 Reverse Roadshow (the “Roadshow” ) of the Company has been successfully held in the Company’s Kunshan headquarter. Over 90 representatives from US, mainland China, Taiwan, Hong Kong, Singapore and Malaysia participated in the Roadshow. Mr. He Ningning, Executive Director and Chairman of the Group, Mr. Wang Jianqiang, Executive Director and Chief Executive Officer of the Group, and Mr. Fan Fuqiang, Chief Financial Officer of the Group, Mr. Liu Tongquan, Assistant General Manager of the group and Mr. Jin YuanBin, Research and Development Director of the Group attended the meeting and had a deep communication with the representatives. The brief of the meeting is as follows:
1.Mr. He Ningning shared the core strategies of Group is dedicated to equip machine with a better vision than human’s eyes. Through the building up of three capabilities: optical, computational and deep learning algorithm and system integrating capability, the Group will focus on producing general hardware (e.g. camera module and fingerprint module), 3D hardware (3D sensing module), Artificial Narrow Intelligence (Mobile based recognition, Automobile based recognition and Industrial based recognition) products and Task level autonomy product
2. Mr. Jin YuanBin, Research and Development Director of the Group shared the industry trend of miniaturization of camera module and 3D sensing module and the according Group’s preparation with the gues
3. Mr. Liu Tongquan, Assistant General Manager of the group shared with the guest about the automation improvement in various production procedures including testing, bonding, logistics and packagin
4. The guests also visited the second phrase production facilities of high end camera modules and dual camera modules to understand the capacity expansion and 3D module R&D progress.